JIS Z 3197 PDF

JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content(mass %). ~ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test( Ω).

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This flux is a high activity, heat stable with minimal fumes and odor.

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. Ideally used mainly by consumer products assemblies’.

Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof. Brass and copper for consumer product. Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate.

The flux according to claim 1, wherein: The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid. Colophony type non-halide cleaning-free soldering flux for lead-free solder wire. Halogen-free low-splash solder wire kis preparation method of halogen-free low-splash solder wire. CN CNA en. Environment protection efficient water-based circuit board cleaning agent and preparation thereof.

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TAMURA CORPORATION TLF Cleanable No-Clean Solder Paste |タムラ製作所

A soldering flux as claimed in his 5, characterized in that: Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.

Aqua-soluble core flux for used by assembly’s manufacturer utilizing water washing cleaning process.

Post flux residues can be washed with lukewarm water O C. CN CNA en A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: A flux according to claim 1, wherein: More than 31977 SnPb More than 80 Sn More than 90 SnPb.

RM-5 (Flux for BGA / CSP Solder Ball)

The film-forming substance in the raw material, i. The residua can be completely removed with luke-warm simple water rinse. Brass and copper Brass and copper for consumer product. Halogen-free lead-free soldering paste for radiator and preparation method thereof. Low-splash and halogen-free welding agent for tin wires and preparation method thereof.

CNA – Non-halide cleaning-free welding flux for leadless solder – Google Patents

Water – soluble core flux. Preparation and use of the same method as in Example 1. The soldering flux does not have halogen, being environmental protective, good in welding, welding mis being full and luminous, without residue, no corrosion, high in isolation resistance.

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Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof.

CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents

Fast and excellent instant wetting action used mainly by x products assemblies manufacturer. The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron. Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof. Clear residue no-clean halide free flux used by assemblies’ manufacturer utilizing low solid no-clean wave soldering fluxes.

Solder fillets can left up to 24 hours and still remains shiny prior sending for post washing with water. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin.

Aqua-soluble core flux was developed for used by assemblies’ manufacturer utilizing water-soluble wave soldering fluxes and aqua-soluble solder paste SME process The flux is thermally heat stable with minimal fumes and odor.